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| Compression Molded Materials | Injection Molded Materials | | | Techtron
PPS | PEEK | Torlon* 4501 | PTorlon * 4503 | Torlon* 5530 Glass | PI | PBI | Torlon* 4203L | Torlon* 4301 | Torlon* 5030 | | | Poly-
phenylene-
sulfide | Poly-
etherether-
ketone | Poly-
amide-
imide | Poly-
amide-
imide | Reinforced Poly-
etherimide | High
Purity Polyimide | Polybenz-
imidazole | Poly-
amide-
imide | Poly-
amide-
imide | Poly-
amide-
imide | | 1 Specific Gravity, 73°F | 1.35 | 1.32 | 1.45 | 1.40 | 1.55 | 1.40 | 1.30 | 1.41 | 1.45 | 1.60 | | 2 Tensile Strength, 73°F | 10,000 | 15,000 | 10,000 | 18,000 | 14,000 | 16,000 | 23,000 | 22,000 | 19,000 | 24,000 | | 3 Tensile Modulus of Elasticity, 73°F | 325,000 | 450,000 | 440,000 | 500,000 | 900,000 | 583,000 | 850,000 | 600,000 | 760,000 | 1,200,0004 | | 4 Elongation, 73°F | 5.0 | 1.0 | 3.0 | 5.0 | 3 | 4 | 3 | 15 | 7 | 4.0 | | 5 Flexural Strength, 73°F | 18,000 | 25,000 | 20,000 | 24,000 | 22,000 | 20,000 | 32,000 | 28,000 | 25,000 | 36,000 | | 6 Flexural Modulus of Elasticity, 73°F | 370,000 | 600,000 | 650,000 | 600,000 | 900,000 | 600,000 | 950,000 | 700,000 | 760,000 | 600,000 | | 7 Shear Strength, 73°F | - | - | - | - | - | - | - | 15,000 | 13,000 | 24,500 | | 8 Compressive Strength, 10% Deformation, 73°F | 18,000 | 17,000 | 21,000 | 26,000 | 27,000 | 24,000 | 50,000 | 32,000 | 24,000 | 38,000 | | 9 Compressive Modulus of Elasticity, 73°F | 410,000 | 450,000 | 400,000 | 370,000 | 600,000 | 450,000 | 900,000 | 700,000 | 950,000 | 600,000 | | 10 Coefficient of Friction (Dry vs Steel) Dynamic | 0.4 | 0.4 | 0.2 | 0.3 | 0.20 | - | 0.24 | 0.35 | 0.2 | - | | 11 Hardness, Rockwell, Scale as noted, 73°F | M93(R125) | M99(R126) | E70(R106) | M80(R119) | E85(R125) | M110 | M105(R125) | M86(R120) | E72(R106) | M90(R125) | | 12 Hardness, Durometer, Shore "D" Scale, 73°F | D85 | D85 | D90 | D90 | D90 | - | - | - | - | - | | 13 Tensile Impact, 73°F | - | - | - | - | - | - | - | - | - | - | | 14 Izod Impact, 73°F | 0.6 | 1.0 | 0.5 | 1.5 | 0.7 | 1.4 | 0.5 | 2.5 | 1.1 | 1.3 | | 15 Coefficient of linear Thermal Expansion | 2.8X10-5 | 2.6 x 10-5 | 2.0 x 10-5 | 1.5 x 10-5 | 1.5 x 10-5 | 2.7 x 10-5 | 1.3 x 10-5 | 1.7 x 10-5 | 14 x 10-5 | 1.0 x 10-5 | | 16 Heat Deflection Temperature, 264psi | 250 | 320 | 534 | 532 | 520 | 680 | 800 | 532 | 532 | 539 | | 17 Tg-Glass Transition (amorphous) | N/A | N/A | 527 | 527 | 527 | - | 800 | 527 | 527 | 527 | | 18 Melting Point (crystalline) | 540 | 644 | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | | 19 Continuous Service Temperature in Air (Max.) | 425 | 480 | 500 | 500 | 500 | 580 | 750 | 500 | 500 | 500 | | 20 Dielectric Strength, Short Term | 450 | 480 | - | 600 | 700 | 700 | 550 | 600 | - | 750 | | 21 Surface Resistivity | - | - | - | - | - | - | - | - | - | - | | 22 Static Decay, Mil-B-8170C | - | - | - | - | - | >20SEC | - | - | - | - | | 23 Volume Resistivity | 4.5 x 1016 | 4.9 x 1016 | 3.0 x 1015 | 8.0 x 1016 | - | >1016 | >1013 | 8.0 x 1016 | 3.0 x 1016 | 6.0 x 1016 | | 24 Dielectric Constant, 106 Hz | 3.0 | 3.3 | 6.0 | 4.2 | - | 3.41 | - | 4.2 | 6.0 | 4.2 | | 25 Dissipation Factor, 106 Hz | 0.0013 | 0.003 | 0.04 | 0.03 | - | .0038 | - | 0.026 | 0.037 | 0.050 | | 26 Water Absorption, 24 hrs | 0.1 | 0.15 | 0.30 | 0.35 | 0.3 | 0.4 | 0.4 | 0.33 | 0.283 | 0.30 | | 27 UL-94 @ 3.1 mm (1/8in.) Est. rating based on available data | V-O | V-O | V-O | V-O | V-O | V-O | V-O | V-O | V-O | V-O | | 28 FM 4910 Compliant | - | - | - | - | - | - | - | - | - | - | | - | 480 | - | - | - | .6 | 10.0 | 14.5 | - | - | | - | 0.2 | - | - | - | .3 | 1.7 | 3.9 | - | - | | - | 0.34 | - | - | - | .8 | 13.0 | - | - | - | | 29 Ionic impurities (Destructive Ash Method) | - | - | - | - | - | - | - | - | - | - | | - | - | - | - | 0.58 | - | 2.50 | 1.85 | - | - | | - | - | - | - | 0.00 | - | 0.00 | 0.00 | - | - | | - | - | - | - | N/A | - | 0.40 | 0.49 | - | - | RED SHADED PRODUCTS ARE NEW ADVANCED ENGINEERING THERMOPLASTIC SPECIALLY DEVELOPED FOR THE SEMICONDUCTOR INDUSTRY |