|    | WAFER MANUFACTURING COMPONENTS | CHEMICAL - MECHANICAL POLISHING Midway through the process of adding the pattern layers to the surface of the wafers, the wafer goes through a process called chemical mechanical polishing or CMP. In chemical-mechanical polishing, chemical agents and abrasives work jointly on the wafer surface to produce a precise surface finish. Homo-polymer and co-polymer acetals, Ertalyte® PET-P Techtron®, PPS or Ketrontm PEEK are used as holding rings that retain wafers during polishing. Techtron® PPS and Ketrontm PEEK withstand the worst chemical and mechanical stresses present during polishing, and are therefore used when the demand is for high strength and wear resistance. The water-driven track system is manufactured from Ertalyte® PET-P, due to its high purity, low coefficient of friction, dimensional stability and non-staining characteristics. Techtron® PPS Advantages - Excellent chemical resistance
- High strength and stiffness to 230°F (HDT)
- Dimensional stability (low water absorption and low CLTE)
- Easily machined
Limitations KetronTM PEEK Advantages - Excellent chemical resistance
- High strength and stiffness to 320°F (HDT)
- Thermal stability to 480°F (CUT)
- Good wear and abrasion resistance
Limitations - Chemical resistance to halogens and their acids including bromine, chlorine, fluorine, HBr and HF
Acetron® GP-Acetal Advantages - Good impact and moderate chemical resistance
- Thermal stability to 200°F
- Good wear and abrasion resistance
- Low water absorption
Hydex 4101 comes in both a white (natural) color and black. It is a standard stock material in a wide range of diameters and thicknesses Ertalyte® PET-P Advantages - Wear resistance of nylon dimensional stability greater than acetal
- High strength, rigidity and stiffness
- Ideal for close tolerance parts
- Excellent stain resistance
- Good chemical resistance to acids and bases
- Good for both wet and dry applications due to low moisture absorption
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