Thermal and dimensional stability and static dissipation are typical requirements for components in back end test equipment. Port Plastics offers a variety of products from DSM-EPP that are ideal for use in these components.

Torlon* 5530 is very dimensionally stable over the broad range of test temperature (-55°C to 150°C). Strength and dimensional stability make Torlon*5530 the ideal material for use in nests and sockets, lasting up to six times longer than traditional materials. (Refer to figure 2 for more information regarding the coefficient of linear thermal expansion (CLTE) of selected DSM-EPP materials.

Semitrontm ESd 500 is ideal for thermal Isolation, where static dissipation is required. It is the only product available which combines high temperature stability, thermal insulation, static dissipation and is non-sloughing. Semitron^TM ESd 420 and Semitron ESd 520 HR are used in device handling applications where controlled dissipation of static charges is critical.

		Handling trays manufactured from Semitrontm ESd 410C dissipate static charges more reliably and are more dimensionally stable.
		Nests and contactors made of glass fiber reinforced Torlon* 5530 PAI plate provide highly reliable results, fewer device rejects, and last up to six times longer than traditional polyimide materials.
		Chip nest and sockets By retaining dimensional stability over a broad temperature range, parts made of Torlon 5530 improve reliability of test connections and extend part life. Prior materials: Vespel* PI
		Seal adapters on test equipment machined from Torlon* 4203 plate provide longer part life and tighter seal fit.
		Static dissipative inserts machined from Semitron@ESd 500 plate reduce damage to sensitive devices due to static discharge.
		High temperature electrical connectors Torlon 4203 and 5530 polyamide-imides provide outstanding electrical performance and high temperature stability. Prior materials: Nylon, PPS, Ultem* PEI
		Insulating blocks made from Semitrontm ESd 500 plate dissipate static electricity reliably in test handling equipment, replacing costly anti-static coating requirements and improving device yields.

Torlon 5530
Compression Molded

30% Glass-reinforced polyamide-imide
It has high rigidity. Retention of stiffness at elevated temperatures (160°C). 5530 exhibits a low expansion rate and is ideal for higher load structural or electronics applications. Replaces polyimides in applications up to temperatures including 500°F (260°C).

Static Dissipative PTFE
Semitron^TM ESd 500

Reinforced with a proprietary synthetic mica. Semitron^TM ESd 500 offers excellent combination of low frictional properties and dimensional stability. Semitron ESd 500 should be considered wherever PTFE is used. It is ideal for applications where controlled bleed of static charges is critical. It is white in color.

• Surface resistivity: 10¹⁰ -10¹² Omega/sq
• Thermal Performance to 500°F (260°C)
• Thermally insulative
• Very low coefficient of friction
• Broad chemical resistance

Static Dissipative PAI
Semitron^TM ESd 520 HR

Semitrontm ESd 520 HR is ideal for handling integrated circuits through the test handler environment. It is black in color and opaque.

• Surface resistivity: 10¹⁰ -10¹² Omega/sq
• Thermal Performance to 520°F (270°C)
• Thermally insulative
• Very low coefficient of friction
• Broad chemical resistance

Static Dissipative PES
Semitron^TM ESd 420

SemitrontmEsd 420 is ideal for handling integrated circuits through the test handler environment. It is black in color and opaque.

• Surface resistivity: 10⁶ -10⁹ Omega/sq
• Thermal performance to 410°F (210°C)
• Low stress for tight tolerance machining
• High strength and stiffness